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Thermal printheads (TPHs) are indispensable core components in modern printing scenarios, widely applied in retail receipt printing, logisti
Pain Points in Thick- and Thin-Film Circuit Fabrication and Ceramic Substrate Advantages
In the pursuit of high performance and high reliability in electronic manufacturing, traditional substrate materials have become increasingl
Applications of Aluminum Nitride Ceramic Substrates for Integrated Circuits and Semiconductor Chip Mounts
Aluminum nitride ceramics with high thermal conductivity, low coefficient of expansion, high strength, high temperature resistance, chemical corrosion resistance, high resistivity, low dielectric loss, is the ideal large-scale integrated circuit heat dissipation substrate and packaging materials, the main raw material for the manufacture of high thermal conductivity aluminum nitride ceramic substrate.
Aluminum nitride is a non-natural existence of man-made crystals, with a hexagonal crystal system of fibrous zincite crystal structure, for
