#icgoodfind

Huawei established the Huawei Integrated Circuit Design Center in 1991, and on this basis, HiSilicon Semiconductor Company was founded in 2004. Initially, HiSilicon focused on manufacturing chips for industrial applications, and later entered the fields of industrial control and mobile phone chips.

Huawei HiSilicon chips are a series of chips independently developed by HiSilicon Semiconductor Company under Huawei. ICgoodFind will also introduce some commonly sold chips in the industrial control industry other than the popular mobile phone Kirin chips.

Chip Features and Advantages:

Advanced Architecture Design: It features an advanced SoC architecture that can efficiently integrate multiple functional modules such as processors, communication modules, and graphics processing, achieving a balance between performance and power consumption.

Powerful Communication Capability: With the integrated self-developed communication baseband, it demonstrates excellent performance in communication, supporting multiple network standards and frequency bands, providing users with stable and fast network connections.

Excellent Artificial Intelligence Capability: It introduced artificial intelligence technology into chips relatively early. For example, the Kirin 970 is equipped with an artificial intelligence NPU chip, providing powerful computing power support for the intelligent applications of mobile phones.

Continuously Upgraded Process Technology: It has continuously evolved from the early 40nm process technology to adopt more advanced process technologies such as 16nm, 7nm, and even 5nm, improving the performance and energy efficiency of the chips.

Now, the commonly used models of HiSilicon chips in the industrial field are:

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We hope that the content summarized by ICgoodFind will be helpful to the vast number of hardware engineers and friends engaged in HiSilicon solution development. In the highly competitive semiconductor arena, Huawei HiSilicon chips are undoubtedly a shining star.

ICgoodFind has been always committed to following and interpreting the dynamics of the chip industry, especially the development of Huawei HiSilicon chips. From its establishment to its in-depth cultivation in different fields, from mobile phone chips to industrial control chips, Huawei HiSilicon chips have demonstrated extraordinary innovative capabilities and indomitable development spirit. The features and advantages of its chips not only reflect the advanced nature of technology but also indicate the future development direction of chips.

XCZU9EG-2FFVB1156E AMD ( XILINX FPGA/CPLD) FCBGA-1156(35x35) XC7S6-1FTGB196I AMD ( XILINX FPGA/CPLD) CSBGA-196(15x15) XC9536XL-10VQG44C AMD ( XILINX FPGA/CPLD) VQFP-44 XC7S50-1CSGA324C AMD ( XILINX FPGA/CPLD) CSGA-324(15x15) XC3S1000-4FG320C AMD ( XILINX FPGA/CPLD) FBGA-320(19x19) XC2VP7-6FG456I AMD ( XILINX FPGA/CPLD) XC2S200E-6FTG256I AMD ( XILINX FPGA/CPLD) XC2S50E-6PQ208I AMD ( XILINX FPGA/CPLD) XC2S150E-6FTG256C AMD ( XILINX FPGA/CPLD) - XC6SLX100-3FG676I AMD ( XILINX FPGA/CPLD) FCBGA-676(27x27) XC5VFX100T-2FF1136I AMD ( XILINX FPGA/CPLD) XC4085XLA-09HQ240C AMD ( XILINX FPGA/CPLD) XC95108-10PQG160C AMD ( XILINX FPGA/CPLD) XC6VLX240T-2FF784I AMD ( XILINX FPGA/CPLD) XC7A25T-1CPG238C AMD ( XILINX FPGA/CPLD) CSBGA-238(10x10) XCR3512XL-10PQ208C AMD ( XILINX FPGA/CPLD) XC9536XL-10PC44I AMD ( XILINX FPGA/CPLD) 44-LCC（J 形引线） XC9536XL-7VQ44C AMD ( XILINX FPGA/CPLD) VQFP-44(10x10) XCV300E-7BG432I AMD ( XILINX FPGA/CPLD) 432-LBGA XCZU4EG-1SFVC784E AMD ( XILINX FPGA/CPLD) FCBGA-784(23x23) XCF16PVOG48 AMD ( XILINX FPGA/CPLD) XC95288XL-7FGG256I AMD ( XILINX FPGA/CPLD) FBGA-256(17x17) XC95288XL-10TQG144 AMD ( XILINX FPGA/CPLD) XCKU040-3FBVA900E AMD ( XILINX FPGA/CPLD) XC3S1600E AMD ( XILINX FPGA/CPLD) XC18V04 AMD ( XILINX FPGA/CPLD) XC7A15T-1CSG325 AMD ( XILINX FPGA/CPLD) XC7A100T-1FGG484 AMD ( XILINX FPGA/CPLD) XC7K160T-FFG676 AMD ( XILINX FPGA/CPLD)

Note: 1. Data source: Association of Semiconductor Industry and China Passenger Car Association (CPCA) related data (automotive-grade chips, including on-board MCU, power chips, sensor chips, etc.). 2. Sales unit: 10,000 pieces. 3. Month-on-month (MoM) / Year-on-year (YoY) are industry estimates; market share is retained to 1 decimal place. 4. Some data are total/estimated values, marked with "≈", ">" and "Total". 5. Definition of automotive-grade chips: Products meeting AEC-Q100/101 standards and adapting to on-board environments. 6. Analysis combines March industry dynamics and public information.

I. Core Data and Analysis of the Overall Market

1. Total sales of automotive-grade chips: 86 million pieces, MoM +58.2%, YoY +27.3%; Core driver: Post-Spring Festival recovery of the automotive market, concentrated inventory replenishment by terminal automakers, and demand expansion driven by the popularization of new energy vehicles (NEVs).

2. Sales of NEV chips: 52 million pieces, MoM +65.4%, YoY +41.5%; Penetration rate 60.5%, core growth from surging demand for intelligent driving chips, on-board infotainment chips and power chips (IGBT).

3. Sales of fuel vehicle chips: 34 million pieces, MoM +48.9%, YoY +8.7%; Demand is mainly for basic control chips and power chips, with a stable overall market and no obvious growth space.

4. Sales of domestic automotive-grade chips: 21.5 million pieces, MoM +72.0%, YoY +68.2%; Domestic substitution is accelerating, focusing on mid-to-low-end fields; the high-performance automotive-grade MCU chip DF30 has completed extreme cold testing, boosting its mass production.

II. Top 10 Automotive-Grade Chip Manufacturers by Sales and Core Information (Ranked by March Sales)

1. Infineon: 14.8 million pieces, MoM +52.3%, YoY +22.5%, market share 17.2%; Core products: Power chips (IGBT), on-board MCU; Cooperating automakers: BYD, Geely; Dominant in high-end power chips.

2. NXP: 13.2 million pieces, MoM +50.7%, YoY +19.8%, market share 15.3%; Core products: On-board MCU, radio frequency (RF) chips; Cooperating automakers: Changan, Chery; Growth rate slowed down due to the impact of domestic RF chip manufacturers.

3. STMicroelectronics (ST): 10.5 million pieces, MoM +55.1%, YoY +24.3%, market share 12.2%; Product coverage: Power chips, sensor chips; Cooperating automakers: Great Wall, GAC Aion; Comprehensive layout and stable market share.

4. Renesas Electronics: 8.9 million pieces, MoM +49.2%, YoY +17.6%, market share 10.3%; Core products: On-board MCU, power management chips; Cooperating automakers: Li Auto, NIO; High-end market under impact from domestic manufacturers.

5. Texas Instruments (TI): 7.8 million pieces, MoM +51.8%, YoY +20.1%, market share 9.1%; Core products: Power management chips, analog chips; Cooperating automakers: Xpeng, Xiaomi Auto; Fierce competition in the mid-to-low-end market.

6. HiSilicon (Huawei): 5.2 million pieces, MoM +82.6%, YoY +75.3%, market share 6.0%; Core products: Intelligent cockpit chips, intelligent driving chips; Cooperating automakers: Seres, Changan, high-end models of BYD; A core representative of domestic high-end chips.

7. Horizon Robotics: 3.8 million pieces, MoM +91.3%, YoY +88.5%, market share 4.4%; Core products: Intelligent driving chips (Journey series); Cooperating automakers: Li Auto, Leapmotor, Voyah; The fastest-growing manufacturer in March.

8. Unigroup Guoxin: 3.2 million pieces, MoM +78.9%, YoY +72.1%, market share 3.7%; Core products: On-board MCU, security chips; Cooperating automakers: Chery, Deepal; Strong competitiveness in mid-to-low-end MCU market.

9. Sinowealth: 2.1 million pieces, MoM +65.4%, YoY +60.8%, market share 2.4%; Core products: Body control chips, power management chips; Cooperating automakers: Wuling, Leapmotor; Obvious cost-performance advantage.

10. Zhejiang Zhixing Microelectronics: ≈1.5 million pieces, MoM +62.8%, YoY +58.7%, market share 1.7%; Core products: On-board microelectronic supporting chips, auxiliary control chips; Focus on supporting regional automakers in Zhejiang.

III. Top 5 Automotive-Grade Chip Segments by Sales and Core Demand (Ranked by March Sales)

1. On-board MCU: 28.5 million pieces, MoM +56.7%, YoY +29.4%; Application: Core of automotive control systems, compatible with all vehicle models; Domestic substitution in mid-to-low-end market is accelerating, while high-end market is still dominated by imports.

2. Power chips (IGBT/MOSFET): 22.8 million pieces, MoM +62.3%, YoY +38.6%; Application: NEV electronic control, charging piles; Demand grows with the increase of NEV penetration rate; High-end market is dominated by imports.

3. Sensor chips: 15.6 million pieces, MoM +53.1%, YoY +22.8%; Application: Autonomous driving, tire pressure monitoring, vehicle body perception; High-end market relies on imports, with great future demand potential.

4. Power Management IC (PMIC): 11.2 million pieces, MoM +49.8%, YoY +18.9%; Application: Power supply for on-board electronic equipment; Fierce market competition, with domestic manufacturers showing prominent cost-performance advantages.

5. Specialized intelligent driving chips: 7.9 million pieces, MoM +95.1%, YoY +86.7%; Application: L2 and above autonomous driving; The fastest-growing segment in March; Domestic high-end chips mass production promotes substitution.

IV. Core Summary and April Trend Forecast

Core Summary: The market recovered overall in March, with NEV chips as the core growth driver (penetration rate 60%); Imports dominate the high-end market while domestic manufacturers seize the mid-to-low-end market; The growth rate of domestic chips is far higher than the industry average, with remarkable breakthroughs in MCU and intelligent driving chips; The rapid growth of intelligent driving chips highlights the trend of automotive intelligence. Against this market background, relying on its advantages of complete product range, stable supply and personalized customization services, and its cooperation with original manufacturers and authorized distributors, ICGOODFIND provides efficient docking services for both supply and demand sides of automotive-grade chips, especially playing an important role in sourcing scarce and special models of chips, and helping the industrial chain operate efficiently.